The proposed facility in Odisha will manufacture advanced packaging glass-core substrates and is expected to generate 1,800 high-skill jobs over the next five to six years
Chip major Intel on Friday signed a pact with 3D Glass Solutions (3DGS) and the Odisha government to set up a $3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region, officials said....
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Via business-standard.com
